CNC Test Socket Manufacture Pinang

Unlock high-precision testing for BGA devices with our Test Socket 484BGA, expertly designed to support 484-ball grid array packages with accuracy and durability. Ideal for development, validation, and production environments, this socket ensures excellent electrical performance, low contact resistance, and secure device alignment.

Experience precision and reliability with the Test Socket 40X40 P-1.25, designed for optimal performance in high-density IC testing applications. With a 40mm x 40mm body size and a 1.25mm pitch configuration, this socket is ideal for testing large-package devices such as high-pin-count processors, ASICs, and custom ICs.

Optimize your high-density IC testing with our precision-engineered Fine Pitch Test Socket, designed to handle today's most compact semiconductor packages. Built for pitches as small as 0.

Achieve exceptional testing performance with the Fujim Test Socket, engineered for high-reliability semiconductor and IC testing. Known for its precision alignment, robust contact design, and long lifecycle, the Fujim Test Socket supports a wide range of packages including BGA, QFN, and LGA.

Enhance your semiconductor testing with our Hi-Performance Burn-In Socket, designed for maximum durability, precision, and efficiency. These advanced sockets are essential for high-temperature and long-duration testing, delivering consistent performance in both engineering and production environments.

Ensure a seamless installation process with our During Installation Test Socket, designed to provide accurate and reliable testing during the installation of semiconductor components. This innovative test socket allows for real-time verification and ensures that each device is properly aligned and functioning before integration into final assemblies.

Optimize your testing process with the Test Socket 1932LD, designed specifically for high-performance applications requiring precise and reliable connections. Supporting a 1932-pin LGA (Land Grid Array) package, this socket ensures stable electrical contact and superior signal integrity for advanced semiconductor devices.

Achieve precise and reliable testing with the Test Socket 896L PBGA 31X31, designed for 896-ball Plastic Ball Grid Array (PBGA) packages with a 31x31 grid configuration.

Maximize testing precision and efficiency with the Test Socket 169L FBGA 14X14, designed specifically for 169-ball Fine Ball Grid Array (FBGA) packages with a 14x14 grid configuration.